NXP Semiconductors

BGS8458

WLAN LNA + Switch

BGS8458

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Product data sheet

Rev. 2 — 24 September 2019

8 / 13

14 Package outline

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOT1234

sot1234_po

16-09-05

16-11-29

Unit

mm

max

nom

min

1.25

A

Dimensions (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

HX2SON6: plastic, thermal enhanced super thin small outline package; no leads;

6 terminals; body 1.4 x 1.2 x 0.32 mm

SOT1234

0.22

D

e

k

0.225

0.30

0.33 0.015

0.010

E

0.65

0.210

v

0.1

y

0.05

0.1

0.4

0.32

1.20 1.00

1.05

0.20

1.45

1.15

0.2

0.18

0.195

0.000

0.55

0.95 1.35

1.40 0.60

D

1

2

3

6

5

4

E

pin 1

index area

A

B

(4x)

B

A

v

B

A

v

e

e

k (2x)

C

y

C

X

detail X

A

scale

0

2 mm

pin 1

index area

Figure 4.  Package outline SOT1234 (HX2SON6)