8
522 - 21 - 02
DOCUMENT IDENTIFICATION:
PRELIMINARY DATA SHEET
The product is in a preproduction phase and specifications are subject
to change without notice.
Gennum Corporation assumes no responsibility for the use of any circuits described herein and makes no representations that they are free from patent infringement.
© Copyright April 1999 Gennum Corporation.
All rights reserved.
Printed in Canada.
REVISION NOTES:
Corrections to Pad Connection diagram and Electrical Characteristics
table.
GENNUM CORPORATION
MAILING ADDRESS:
P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3
Tel. +1 (905) 632-2996 Fax +1 (905) 632-2814
SHIPPING ADDRESS:
970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5
GENNUM JAPAN CORPORATION
C-101, Miyamae Village, 2-10-42 Miyamae, Suginami-ku, Tokyo 168-0081,
Japan
Tel. +81 (3) 3334-7700 Fax: +81 (3) 3247-8839
PAD LAYOUT
PAD NO.
X
Y
1
0 [0.0]
0 [0.0]
2
564 [22.2]
0 [0.0]
3
1123 [44.2]
0 [0.0]
4
1682 [66.2]
379 [14.9]
5
1682 [66.2]
633 [24.9]
6
1682 [66.2]
900 [35.4]
7
1682 [66.2]
1903 [74.9]
8
1682 [66.2]
2157 [84.9]
9
1682 [66.2]
2411 [94.9]
10
1682 [66.2]
2665 [104.9]
11
1682 [66.2]
3161 [124.4]
12
1682 [66.2]
3415 [134.4]
13
1682 [66.2]
3669 [144.4]
14
1682 [66.2]
3923 [154.4]
15
1123 [44.2]
3923 [154.4]
16
564 [22.2]
3923 [154.4]
17
0 [0.0]
3923 [154.4]
18
0 [0.0]
3536 [139.2]
19
0 [0.0]
1707 [67.2]
20
0 [0.0]
1276 [50.2]
21
0 [0.0]
3079 [121.2]
185 (7.28)
1
11
2
3
4
5
6
7
8
9
20
21
12 13 14
15
16
17
18
19
GP522
10
4293 MAX (169 MAX )
2057 MAX
(81 MAX)
185
(7.28)
Cell 0,0
SPECIFICATIONS
DIE THICKNESS
254
µm [10mils] MAX
MIN BOND PAD OPENING
BUMP SPEC DOCUMENT
Dimensions are in micrometers.
Dimensions shown in parenthesis are in mils
converted from micrometers,
and include minor rounding errors.
1 mil = 25.4
µm
CHIP DIMENSIONS
Attention: The GP522 Controller Chip is visually inspected at an AQL of 0.65%
based on MILSTD105E sampling plan, rather than being subjected to 100%
visual inspection.
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