OPA992 datasheet(8/70 Pages) TI

8 / 70 page

6.4 Thermal Information for Single Channel (continued)

THERMAL METRIC(1)

OPA992, OPA992S

UNIT

DBV

(SOT-23)

DCK

(SC70)

5 PINS

6 PINS

5 PINS

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information for Dual Channel

THERMAL METRIC(1)

OPA2992

Unit

(SOIC)

DDF

(SOT-23)

DGK

(VSSOP)

DSG

(WSON)

(TSSOP)

8 PINS

RθJA

Junction-to-ambient thermal

resistance

131.0

149.6

174.2

74.8

183.4

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

73.0

85.3

65.9

93.6

72.4

°C/W

RθJB

Junction-to-board thermal

resistance

74.5

68.6

95.9

42.1

114.0

°C/W

ψJT

Junction-to-top characterization

parameter

25.0

7.9

11.0

3.8

12.1

°C/W

ψJB

Junction-to-board

characterization parameter

73.8

68.4

94.4

41.9

112.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

17.0

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information for Quad Channel

THERMAL METRIC(1)

OPA4992

UNIT

(SOIC)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

99.0

118.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

55.1

47.0

°C/W

RθJB

Junction-to-board thermal resistance

54.8

61.9

°C/W

ψJT

Junction-to-top characterization parameter

16.7

5.5

°C/W

ψJB

Junction-to-board characterization parameter

54.4

61.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

OPA992, OPA2992, OPA4992

SBOSA10D – JUNE 2021 – REVISED AUGUST 2022

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