MEPIA

www.vishay.com

Vishay Sfernice

Revision: 08-Feb-2019

3

Document Number: 53079

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ASSEMBLY PRECAUTIONS

In order to obtain reproducible ignition performances it is important that the assembly process fulfills the following criteria:

- Take specific precautions, such as no air bubble during preparation and application of primer, in order to ensure the intimate

contact of pyrotechnic primer and MEPIA active area (potential misfire)

- Take specific handling precaution in order not to damage MEPIA active area (ex: pickup head design for pick and place or

specific fixing tools in the entire assembly process)

- All along the assembly process, take specific care to extreme thermo-mechanic stress that could be applied to the MEPIA

(such as stress induced during over molding) because the active area of MEPIA is subjected to crack (and generate unstable

resistance value)

- The MEPIA reliability is only guaranteed for one single reflow profile

- In case of necessity to dismantle a MEPIA, another MEPIA must be used (no rework is allowed)

- Pay specific attention to the cleaning process after reflow soldering in order not to damage the active area and to keep it clean

from various pollution

ORDERING PROCEDURE

Global Part Numbering: MEPIA0805-2R0ILT09

MODEL

SIZE

VALUE

TOLERANCE

ENERGY

CLASS

PACKAGING

OPTION

MEPIA

0805

2R0

I = 7.5 %

K = 10 %

L = 20 %

M = 30 %

L = low

(typical all fire

= 500 μJ)

H = high

(typical all fire

= 1 mJ)

For more

information see

“Codification of

packaging”

table

Leave blank

if no option

CODIFICATION OF PACKAGING

CODE 18

PACKAGING

REMARK

(USUAL ASSEMBLY PROCESS)

T

Tape and reel (plastic tape)

Automatic pick-and-place

W

Waffle pack

Manual placing on PCB

B

Bag

Bowl feeding

PI

0

A8

0

-

52

E

M

R

0

I

L

T

0

9