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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
F3018_SMP253_Y2_250 • 11/2/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Class Y2
Impregnated Metallized Paper EMI Suppression Capacitors – SMP253, Class Y2, 250 VAC Surface Mount Device
Performance Characteristics
Rated Voltage
250 VAC 50/60 Hz
Capacitance Range
0.001 – 0.0047 µF
Capacitance Tolerance
±20%
Temperature Range
−40°C to +100°C
Climatic Category
40/100/56/B
Approvals
ENEC, cULus
Dissipation Factor
Maximum Values at +23°C
1 kHz
1.3%
Test Voltage Between Terminals
The 100% screening factory test is carried out at 3,000 VDC. The
voltage level is selected to meet the requirements in applicable
equipment standards. All electrical characteristics are checked
after the test. This test may not be repeated due to potential
capacitor damage. KEMET is not liable for any failures that
result from repeating the test.
Insulation Resistance
Between Terminals
12,000 MΩ
Cleaning/Storage and Moisture Recommendations
Cleaning Suggestions
To clean the PCB assembly KEMET recommends to use a suitable solvent like Isopropyl alcohol, deionized water or neutral
pH detergents. Aggressive solvents shall not be used. For any different cleaning solvent used please contact KEMET
Technical Services to analyze the potential impact on KEMET products.
Storage and Moisture Recommendations
KEMET SMD film capacitors are supplied in a moisture barrier bag (MBB) Class 1. We can guarantee a 24 month shelf life
(temperature ≤ 40°C/relative humidity ≤ 90%). After the MBB has been opened, components may stay in areas with controlled
temperature and humidity (temperature ≤ 30°C/relative humidity ≤ 60%) for 168 hours (MSL 3). For longer periods of time
and/or higher temperature and/or higher relative humidity values, it is absolutely necessary to protect the components
against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use the same MBB or to avoid areas
without controlled temperature and humidity (see above). If the above conditions are not respected, components require
baking (minimum time: 48 hours at 55 ±5°C, ≤ 5% RH) before the reflow.
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