5
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
F3018_SMP253_Y2_250 • 11/2/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Class Y2
Impregnated Metallized Paper EMI Suppression Capacitors – SMP253, Class Y2, 250 VAC Surface Mount Device
Table 1 – Ratings & Part Number Reference
Capacitance
Value (µF)
Maximum Dimensions in mm
dV/dt
(V/µs)
KEMET
Part Number
Customer
Part Number
W
−0/+0.6
T
−0/+0.4
L
−0/+0.4
0.0010
11.5
6.5
12.7
2,000
P101AA102M250(1)
SMP253MA4100M(1)
0.0015
11.5
6.5
12.7
2,000
P101AA152M250(1)
SMP253MA4150M(1)
0.0022
11.5
6.5
12.7
2,000
P101AA222M250(1)
SMP253MA4220M(1)
0.0025
11.5
6.5
12.7
2,000
P101AA252M250(1)
SMP253MA4250M(1)
0.0033
11.5
6.5
12.7
2,000
P101AA332M250(1)
SMP253MA4330M(1)
0.0039
11.5
6.5
12.7
2,000
P101AA392M250(1)
SMP253MA4390M(1)
0.0047
11.5
6.5
12.7
2,000
P101AA472M250(1)
SMP253MA4470M(1)
Capacitance
Value (µF)
W (mm)
T (mm)
L (mm)
dV/dt
(V/µs)
KEMET
Part Number
Customer
Part Number
(1) Insert packaging code. See Ordering Options Table for available options.
Soldering Process
Reflow soldering temperature is measured on the top
body surface of the component. Use the recommended
soldering profiles for convection reflow ovens and IR
reflow ovens. If a vapor phase reflow oven is used,
consult KEMET. Exceeding the manufacturer’s process
recommendations may harm the component. KEMET
is not liable for any defect caused by exceeding
recommendations. According to international standards,
the maximum temperature capability must be measured
on the top surface of a component. The international
standards do not define how the thermocouple should
be fastened on the component. Our recommendation
for attaching the thermocouple to the top surface of the
component is to glue it with high-temperature
resistant glue.
0
40
150°C
170°C
223°C
Max. 250°C
80
120
160
200
240
280
Time (s)
Min. 30 seconds,
Max. 50 seconds,
above 217°C
0 30 60 90 120 150 180 210 240 270 300 330
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