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STPSC12065 Datasheet(PDF) 4 Page - STMicroelectronics |
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STPSC12065 Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 14 page ![]() Figure 5. Relative variation of thermal impedance junction to case versus pulse duration 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 tp(s) Zth(j-c) /Rth(j-c) Single pulse Figure 6. Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) 1.E+01 1.E+02 1.E+03 1.E-05 1.E-04 1.E-03 1.E-02 tp(s) IFSM(A) Ta=25 °C Ta=125 °C Figure 7. Total capacitive charges versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 0 50 100 150 200 250 300 350 400 VR(V) QCj(nC) Figure 8. Thermal resistance junction to ambient versus copper surface under tab (typical values) 0 10 20 30 40 50 60 0 5 10 15 20 25 30 35 40 Rth(j-a) (°C/W) D²PAK / D²PAK HV Epoxy printed board FR4, copper thickness = 70 µm SCu(cm²) STPSC12065 Characteristics (curves) DS11623 - Rev 3 page 4/14 |
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