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DS25MB200 Datasheet(PDF) 9 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # DS25MB200
Description  Dual 2.5 Gb/s 1:2 Mux/Buffer with Input Equalization and Output Pre-Emphasis
PDF  13 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

DS25MB200 Datasheet(HTML) 9 Page - National Semiconductor (TI)

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Electrical Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
(Note 2)
Max
Units
AC CHARACTERISTICS
t
SM
Mux Switch Time
Measured from V
IH or VIL of the mux-control
or loopback control to 50% of the valid
differential output.
1.8
6
ns
RJ
Device Random Jitter
(Note 5)
See Figure 5 for test circuit.
Alternating-1-0 pattern.
Pre-emphasis disabled.
At 1.25 Gbps
At 2.5 Gbps
2
2
psrms
psrms
DJ
Device Deterministic
Jitter (Note 6)
See Figure 5 for test circuit.
Pre-emphasis disabled.
Between 0.8 and 2.5 Gbps with PRBS7
pattern for DS25MB200 @ 0˚c–85˚C
30
Pspp
DR
MAX
Maximum Data Rate
Tested with alternating-1-0 pattern
2.5
Gbps
Note 1: “Absolute Maximum Ratings” are the ratings beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits.
Note 2: Typical parameters measured at VCC = 3.3V, TA = 25˚C. They are for reference purposes and are not production-tested.
Note 3: IN+ and IN− are generic names refer to one of the many pairs of complimentary inputs of the DS25MB200. OUT+ and OUT− are generic names refer to
one of the many pairs of the complimentary outputs of the DS25MB200. Differential input voltage VID is defined as |IN+–IN−|. Differential output voltage VOD is
defined as |OUT+–OUT−|.
Note 4: K28.7 pattern is a 10-bit repeating pattern of K28.7 code group {001111 1000}
K28.5 pattern is a 20-bit repeating pattern of +K28.5 and −K28.5 code groups {110000 0101 001111 1010}
Note 5: Device output random jitter is a measurement of the random jitter contribution from the device. It is derived by the equation sqrt(RJOUT
2–RJ
IN
2), where
RJOUT is the total random jitter measured at the output of the device in psrms, RJIN is the random jitter of the pattern generator driving the device.
Note 6: Device output deterministic jitter is a measurement of the deterministic jitter contribution from the device. It is derived by the equation (DJOUT–DJIN), where
DJOUT is the total peak-to-peak deterministic jitter measured at the output of the device in pspp, DJIN is the peak-to-peak deterministic jitter of the pattern generator
driving the device.
Note 7: tSKO is the magnitude difference in the propagation delays among data paths between switch A and switch B of the same port and similar data paths
between port 0 and port 1. An example is the output skew among data paths from SIA_0± to LO_0±, SIB_0± to LO_0±, SIA_1± to LO_1± and SIB_1± to LO_1±.
Another example is the output skew among data paths from LI_0± to SOA_0±, LI_0± to SOB_0±, LI_1± to SOA_1± and LI_1± to SOB_1±.tSKO also refers to the
delay skew of the loopback paths of the same port and between similar data paths between port 0 and port 1. An example is the output skew among data paths
SIA_0± to SOA_0±, SIB_0± to SOB_0±, SIA_1± to SOA_1± and SIB_1± to SOB_1±.
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