Rev Date: 11/18/2020

3

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This specification may be changed at any time without prior notice.

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Please confirm technical specifications before you order and/or use.

HGC Series

Thick Film Precision High Resistance Chip Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

RoHS Compliance

Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various

regulatory requirements now

prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances”

(RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our

compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as

amended by Directive (EU) 2015/863/EU as regards the list of restricted substances.

RoHS Compliance Status

HGC

Thick Film Precision High Resistance

Chip Resistor

SMD

YES(1)

100% Matte Sn over Ni

Always

Always

Note (1): RoHS Compliant by means of exemption 7c-I.

Standard

Product

Series

Description

Package /

Termination

Type

Standard

Series

RoHS

Compliant

Lead-Free Termination

Composition

Lead-Free

Mfg. Effective Date

(Std Product Series)

Lead-Free

Effective Date

Code

(YY/WW)

Recommended Lead Free Resistor Reflow Profile

Wave Soldering

Description

Maximum

Recommended

Minimum

Preheat Time

80 seconds

70 seconds

60 seconds

Temperature Diff.

140°C

120°C

100°C

Solder Temp.

260°C

250°C

240°C

Dwell Time at Max.

10 seconds

5 seconds

*

Ramp DN (°C/sec)

N/A

N/A

N/A

Temperature Diff. = Defference between final preheat stage and soldering stage.

Convection IR Reflow

Description

Maximum

Recommended

Minimum

Ramp Up (°C/sec)

3°C/sec

2°C/sec

*

Dwell Time > 217°C

150 seconds

90 seconds

60 seconds

Solder Temp.

260°C

245°C

*

Dwell Time at Max.

30 seconds

15 seconds

10 seconds

Ramp DN (°C/sec)

6°C/sec

3°C/sec

*