AP22804 / AP22814

Document number: DS39137 Rev. 3 - 2

13 of 19

www.diodes.com

July 2017

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AP22804 / AP22814

Application Information

Input and Output Capacitors

It is needed to place a 1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device. Placing a high-value capacitor (10μF

or 47μF) close to input pin is also recommended when the output transient load is heavy. This precaution reduces power-supply transients that

may cause ringing on the input.

Connect a minimum 100μF low ESR electrolytic or tantalum capacitor (or 10μF MLCC) between OUT and GND is also needed for hot-plug

applications. It’s a must to bypass the output with a 0.1μF ceramic capacitor which improves the immunity of the device to short-circuit transients.

The Bulky 100μF or larger capacitors help to reduce output droop voltage when a device is plugged in. When abnormal short-circuit condition

happens, these capacitors can also reduce output negative voltage due to parasitic inductive effect and avoid device damage.

Please note without the bypass capacitors, an output short may cause ringing on the input; if the voltage is over the maximum voltage rating, it will

destroy the internal control circuitry even the duration is short.

FLG Response

When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 6ms

deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy

capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 6ms deglitch

timeout. The AP22804/AP22814 is designed to eliminate false over-current reporting without the need of external components to remove

unwanted pulses.

It is to be noted that, when the FLG pin is not supplied via the same VIN voltage source of the AP22804/AP22814 but other external power source,

it is strongly required that the AP22804/AP22814 must be sure to reach a stable operating voltage condition before the other power source applied

to FLG pin.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series

resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output

voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN

has been applied. The AP22804/AP22814 senses the short circuit and immediately clamps output current to a certain safe level.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may

flow for a very short period of time before the current limit function can react. After the current limit function has tripped, the device switches into

current limiting mode and the current is clamped at ILIMIT, or ISHORT.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the

current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP22804/AP22814 is capable of delivering current

up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting

mode and is set at ILIMIT.

Thermal Protection

Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The

AP22804/AP22814 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die

temperature rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal

sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing

the device to cool down approximately +35°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or

input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 6ms deglitch.

ON/OFF Input Operator

The EN input allows the output current to be switched on and off using a GPIO compatible input. The high signal (switch on) should be at least

1.5V, and the low signal (switch off) no higher than 0.65V. This pin should NOT be left floating. It is advisable to hold the EN signal low when

applying or removing power.