AP7383

Document number: DS40699 Rev. 6 - 2

3 of 13

www.diodes.com

August 2020

© Diodes Incorporated

AP7383

Absolute Maximum Ratings (Note 4) (@ TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Rating

Unit

VIN

Supply Input Voltage

33

V

VEN

Enable Input Voltage

33

V

IOUT

Output Current

200

mA

TLEAD

Lead Temperature (Soldering, 10s)

+260

°C

TJ

Operating Junction Temperature

+150

°C

PD

Power Dissipation

SOT25 (W5/WW Package)

518

mW

SOT25 (WR Package)

602

SOT89

847

U-DFN2020-6 (Type C)

658

ϴJA

Thermal Resistance (Junction to Ambient)

SOT25 (W5/WW Package)

193

°C/W

SOT25 (WR Package)

166

SOT89

118

U-DFN2020-6 (Type C)

152

ϴJC

Thermal Resistance (Junction to Case)

SOT25 (W5/WW Package)

68

°C/W

SOT25 (WR Package)

26

SOT89

20

U-DFN2020-6 (Type C)

58

TSTG

Storage Temperature Range

-65 to +150

°C

—

ESD (Machine Model)

250

V

—

ESD (Human Body Model)

2500

V

Note:

4. a). Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods can affect

device reliability.

b). Ratings apply to ambient temperature at +25°C. The JEDEC High-K board design used to derive this data is a 2inch × 2inch multi-layer board with

1oz internal power and ground planes and 2oz copper traces on the top and bottom of the board.

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

VIN

Supply Input Voltage

3.5

30

V

TJ

Operating Junction Temperature

-40

+125

°C