VD6283TX datasheet(51/59 Pages) STMICROELECTRONICS

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10.5

Lead-free solder reflow process

The table and figure below show the recommended and maximum values for the solder profile. Customers will

have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect customers to

follow the “recommended” reflow profile, which is specifically tuned for the VD6283 package. For any reason, if a

customer must perform a reflow profile which is different from the “recommended” one (especially peak >240 °C),

this new profile must be qualified by the customer at their own risk. In any case, the profile has to be within the

“maximum” profile limit described in the figure below.

Table 24. Recommended soldering profile

Parameters

Recommended

Maximum

Units

Minimum temperature (TSmin)

Maximum temperature (TSmax)

Time ts (TSmin to TSmax)

100

180

150

200

60-120

°C

Temperature (TL)

Time (tL)

Ramp up

180

110

1.5

217

60-150

°C

°C/s

Temperature (Tp-10)

Time (as index)

Ramp up

230

—

0.5

250

°C

°C/s

Peak temperature (Tp)

240

260

°C

Time to peak

220

480

Ramp down (peak to TL)

-2

-6

°C/s

Note:

The temperature mentioned in the above table is measured on top of the VD6283 package.

Note:

The VD6283 can sustain up to three passes maximum through the recommended solder reflow profile.

Figure 26. Soldering profile

VD6283TX

Lead-free solder reflow process

DS13735 - Rev 1

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