SSOP36 EP

CASE 940AB

ISSUE A

DATE 19 JAN 2016

SCALE 1:1

DIM

MIN

MAX

MILLIMETERS

E2

3.90

4.10

A

2.65

A1

---

0.10

L

0.50

0.90

e

0.50 BSC

c

0.23

0.32

h

0.25

0.75

b

0.18

0.30

D2

5.70

5.90

L2

0.25 BSC

M

0

8

__

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 TOTAL IN

EXCESS OF THE b DIMENSION AT MMC.

4. DIMENSION b SHALL BE MEASURED BE-

TWEEN 0.10 AND 0.25 FROM THE TIP.

5. DIMENSIONS D AND E1 DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. DIMENSIONS D AND E1 SHALL BE

DETERMINED AT DATUM H.

6. THIS CHAMFER FEATURE IS OPTIONAL. IF

IT IS NOT PRESENT, A PIN ONE IDENTIFIER

MUST BE LOACATED WITHIN THE INDICAT-

ED AREA.

PIN 1

REFERENCE

D

E1

0.10

SEATING

PLANE

36X

b

E

e

DETAIL A

---

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer

to device data sheet for actual part

marking.

XXXXXXXXXX

XXXXXXXXXX

XXXXXXXXXX

AWLYYWWG

SOLDERING FOOTPRINT

L

L2

GAUGE

DETAIL A

e/2

DETAIL B

A2

2.15

2.60

E1

7.50 BSC

PLANE

SEATING

PLANE

C

X

c

h

END VIEW

A

M

0.25

B

T

TOP VIEW

SIDE VIEW

A-B

0.20 C

118

19

36

A

B

D

DETAIL B

36X

A1

A2

C

C

D2

E2

BOTTOM VIEW

XXXX = Specific Device Code

A

= Assembly Location

WL

= Wafer Lot

YY

= Year

WW

= Work Week

G

= Pb−Free Package

36X

D

10.30 BSC

E

10.30 BSC

M1

5

15

__

5.90

36X

1.06

36X

0.36

0.50

DIMENSIONS: MILLIMETERS

PITCH

4.10

10.76

1

0.25 C

S

S

4X

H

A

X = A or B

h

NOTE 6

M1

M

36X

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON46215E

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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