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5.5 Thermal Information

Symbol

Description

Heater off, die

pad soldered

(K/W)

Heater on, die

pad soldered

(K/W)

Heater off, die pad

not soldered

(K/W)

Heater on, die pad

not soldered

(K/W)

Junction-to-ambient

thermal resistance

246

308

297

357

Junction-to-case

thermal resistance

189

255

191

257

Junction-to-board

thermal resistance

159

225

193

258

Junction-to-board

characterization param.

159

223

191

254

Junction-to-top

characterization param.

38

105

44

112

Table 8 Typical

values for thermal metrics. In the “heater on” columns a heater power of 200 mW was

assumed. Soldering of the die pad is not recommended, therefore the two right hand side columns are bold.

Values are based on simulation.

6 Quality and Material Contents

Qualification of SHT4xI-Digital is performed based on the JEDEC JESD47 qualification test

method. Qualification pending. The device is fully RoHS and WEEE compliant, e.g. free of Pb,

Cd, and Hg.

For general remarks of best practice in processing humidity sensor please refer to (Sensirion,

Handling Instructions for Humidity Sensors, 2020).

7 Tape and Reel Packaging

All specifications for the tape and reel packaging can be found on Figure 10. Reel diameters are

13 inch and 8 inch for the 10k and the 2.5k packaging sizes, respectively.

Figure 10: Tape and reel specifications including sensor orientation in pocket (see indication of two sensors

on the right side of the tape).