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TMUX7348F Datasheet(PDF) 5 Page - Texas Instruments |
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TMUX7348F Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 60 page ![]() Table 6-2. Pin Functions: TMUX7349F (continued) PIN TYPE(1) DESCRIPTION NAME TSSOP WQFN S2A 5 3 I/O Overvoltage protected source pin 2A. Can be an input or output. S2B 16 14 I/O Overvoltage protected source pin 2B. Can be an input or output. S3A 6 4 I/O Overvoltage protected source pin 3A. Can be an input or output. S3B 15 13 I/O Overvoltage protected source pin 3B. Can be an input or output. S4A 7 5 I/O Overvoltage protected source pin 4A. Can be an input or output. S4B 14 12 I/O Overvoltage protected source pin 4B. Can be an input or output. SF 10 8 O Specific fault flag. Table 9-2 provides how this pin is an open drain output and is asserted low when overvoltage condition is detected on a specific pin, depending on the state of A0, A1, and EN. Connect this pin to an external supply (1.8 V to 5.5 V) through a 1-kΩ pull-up resistor. VDD 18 16 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND. VFN 9 7 P Negative fault voltage supply that determines the overvoltage protection triggering threshold on the negative side. Connect to VSS if the triggering threshold will be the same as the device's negative supply. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VFN and GND. VFP 12 10 P Positive fault voltage supply that determines the overvoltage protection triggering threshold on the positive side. Connect to VDD if the triggering threshold will be the same as the device's positive supply. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VFP and GND. VSS 3 1 P Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND. Thermal Pad — Thermal pad. The thermal pad is not connected internally. It is recommended to tie the pad to GND or VSS for best performance. (1) I = input, O = output, I/O = input and output, P = power www.ti.com TMUX7348F, TMUX7349F SCDS400A – MARCH 2022 – REVISED NOVEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TMUX7348F TMUX7349F |
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