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Mechanical Drawing

Bond Pad #1 (RF In)

Bond Pad #2 (Vg2)

Bond Pad #3 (Vd)

Bond Pad #4 (RF Out)

Bond Pad #5 (Vg1)

Bias Arrangement

Bypass Capacitors - See App Note [2]

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

0.05-50.0 GHz GaAs MMIC

Distributed Amplifier

D1002

(Note: Engineering designator is 25LN6DA0522)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.417 mg.

1

2

4

5

3

Vg2

RF In

RF Out

Vd

Vg1

1

2

4

5

1.300

(0.051)

0.295

(0.012)

1.950

(0.077)

0.0

0.0

0.295

(0.012)

3

0.695

(0.027)

1.005

(0.040)

1.360

(0.054)

RF Out

Vg1

RF In

Vd

Vg2

August 2005 - Rev 04-Aug-05