AP3981C

Document number: DS41619 Rev. 2 - 2

15 of 16

www.diodes.com

June 2019

© Diodes Incorporated

AP3981C

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1)

Package Type: SO-8

SO-8

Dim

Min

Max

Typ

A

1.40

1.50

1.45

A1

0.10

0.20

0.15

b

0.30

0.50

0.40

c

0.15

0.25

0.20

D

4.85

4.95

4.90

E

5.90

6.10

6.00

E1

3.80

3.90

3.85

E0

3.85

3.95

3.90

e

--

--

1.27

h

--

--

0.35

L

0.62

0.82

0.72

Q



0.60

0.70

0.65

All Dimensions in mm

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1)

Package Type: SO-8

Dimensions Value (in mm)

C

1.27

X

0.802

X1

4.612

Y

1.505

Y1

6.50

Note:

The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These

dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering

and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for

Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Note:

For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances

between device Terminals and PCB tracking.

1

b

e

E

A

A1

9° (

All sides

)

4°± 3°

c

Q

h

R 0.1

7°

D

E0

E1

L

Seating Plane

Gauge Plane

C

X

Y

Y1

X1