6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)

MIN

MAX

UNIT

VI

Input voltage(2)

–0.5

7

V

VI/O

Input/output voltage(2)

–0.5

7

V

Continuous channel current

128

mA

IIK

Input clamp current

VI < 0

–50

mA

TJ

Max Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The input and input/output negative-voltage ratings may be exceeded if the input and input/output clamp-current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VI/O

Input/output voltage

0

5

V

Vref_A/B/EN

Reference voltage

0

5

V

IPASS

Pass transistor current

64

mA

TA

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

LSF0108-Q1

UNIT

PW (TSSOP)

WRKS (VQFN)

20 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

110.7

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

45.4

TBD

°C/W

RθJB

Junction-to-board thermal resistance

62.6

TBD

°C/W

ψJT

Junction-to-top characterization parameter

6.6

TBD

°C/W

ψJB

Junction-to-board characterization parameter

61.9

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

LSF0108-Q1

SDLS967E – MAY 2016 – REVISED NOVEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

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