ADA10001

Data Sheet - Rev 2.3

02/2005

7

H

E

e

B 1

A

B

A 2

L

a

C

LE

0.003 [0.076mm]

A1

GAUGE PLANE

SEATING PLANE

D

0.015 [0.38]X45

a

L

e

E

A

D

B

L

S

O

Y

B

M

MILLIMETERS

INCHES

NOTE

MAX.

MIN.

MAX.

MIN.

H

LE

C

2

3

4

1

B

0.020

0.50

0.33

0.013

0.10

1.47

0.25

1.73

0.068

0.010

0.058

0.004

0.055

0.065

1.65

1.40

0.25

0.20

0.010

0.008

8

0

8

0

6.20

5.74

0.244

0.226

0.380

0.150

0.400

0.160

4.06

10.16

3.81

9.66

0.050 BSC

1.27 BSC

0.016

0.040

0.41

1.02

0.030

0.76

0.062

1.58

1.78

0.070

4. LEAD THICKNESS AFTER PLATING TO BE 0.013 [0.33mm]

MAXIMUM.

PER SIDE.

1. CONTROLLING DIMENSION: INCHES

2. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS

AND GATE BURRS SHALL NOT EXCEED 0.006 [0.15mm]

3. DIMENSION "E" DOES NOT INCLUDE INTER-LEAD FLASH OR

PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS

SHALL NOT EXCEED 0.010 [0.25mm] PER SIDE.

NOTES:

SPECIFICATION:

SUBJECT:

16 LEAD BATWING SOIC PKG.

PUBLISHED OUTLINE,

98000-006

PACKAGE OUTLINE

Figure 10: S3 Package Outline - Modified 16 Pin SOIC