Copyright

© ANPEC Electronics Corp.

Rev. A.1 - Jun., 2006

APL5330

www.anpec.com.tw

3

Symbol

Parameter

Rating

Unit

VCNTL Supply Voltage, VCNTL to GND

-0.2 ~ 7

V

VIN Supply Voltage, VIN to GND

-0.2 ~ 3.9

V

Power Dissipation

Internally Limited

W

Junction Temperature

150

Storage Temperature

-65 ~ 150

Soldering Temperature, 10 Seconds

300

Minimum ESD Rating (Human Body Mode)

±3

kV

Absolute Maximum Ratings

Thermal Characteristics

Symbol

Parameter

Value

Unit

θ

JA

Junction-to-Ambient Thermal Resistance in Free Air

SOP-8

SOP-8-P

75

55

θ

JC

Junction-to-Case Thermal Resistance

SOP-8

SOP-8-P

28

20

Note :

exposed pad of SOP-8-P is soldered directly on the PCB.

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

VCNTL Supply Voltage (Note 1)

3.1 ~ 6

V

VIN Supply Voltage (Note 2)

1.2 ~ 3.5

V

VREF Input Voltage

0.8 ~ 3

V

VOUT Output Voltage (Note 3)

± 0.02

V

VOUT Output Current (Note 4)

2

A

Junction Temperature

-20 ~ 125

Notes :

1. Please refer to the VCNTL-to-Vin Dropout Voltage in the “Typical Characteristics” section for the minimun

supply voltage on VCNTL.

2. Please supply enough voltage to VIN for providing desired maximum output current. Please refer to the VIN.

Dropout Voltage vs Output Current in the Typical Characteristics.

conditions.

4. The maximum I