OPA863 datasheet(8/52 Pages) TI

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7.4 Thermal Information: OPA863

THERMAL METRIC(1)

OPA863

UNIT

DBV (SOT23)

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

161.8

168.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

73.9

64.3

°C/W

RθJB

Junction-to-board thermal resistance

42.6

40.6

°C/W

ΨJT

Junction-to-top characterization parameter

21.2

14.2

°C/W

YJB

Junction-to-board characterization parameter

42.5

40.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2863

THERMAL METRIC(1)

OPA2863

UNIT

DGK (VSSOP)

D (SOIC)

RUN (WQFN)

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

180.3

120.0

110.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

67.5

63.3

66.8

°C/W

RθJB

Junction-to-board thermal resistance

101.9

63.2

43.6

°C/W

ΨJT

Junction-to-top characterization parameter

9.8

17.2

2.9

°C/W

YJB

Junction-to-board characterization parameter

100.1

62.5

43.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: OPA4863

THERMAL METRIC(1)

OPA4863

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

99.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

27.6

°C/W

RθJB

Junction-to-board thermal resistance

56.1

°C/W

ΨJT

Junction-to-top characterization parameter

4.4

°C/W

YJB

Junction-to-board characterization parameter

55.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA863, OPA2863, OPA4863

SBOS982I – JUNE 2020 – REVISED DECEMBER 2022

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