6.6 Alternate Industry Standard Compatible PCB Land Pattern

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EXAMPLE BOARD LAYOUT

.000 PKG

0

(

)

2.9

(

)

2.25

(

)

2.05

(

)

1.275

(

)

0.5

(

)

0.3

(

)

0.3

5X (

)

1.15

5X ( )

2

(

)

2.6

(

) TYP

3.2

(

)

0.025

(

)

2.2

(

)

0.8

(

)

0.4

(

)

0.1

(

)

0.3

(

)

2.25

16X (0.6)

16X (0.25)

14X (0.45)

19X (0.45)

(

)

1.05

(

)

2.05

(

)

2.175

(

) TYP

2.75

20X (0.25)

(R0.05) TYP

(0.05) MIN

TYP

(

0.2) VIA

TYP

VQFN-CLIP - 1.05 mm max height

RWJ0041A

PLASTIC QUAD FLATPACK - NO LEAD

4221590/D 04/2019

NOTES: (continued)

4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

7

LAND PATTERN EXAMPLE

SOLDER MASK DEFINED

SCALE: 20X

PKG

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING, TYP

1

6

9

10

19

20

24

25

29

30

39

40

41

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning

and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525

may have alternate design recommendations.

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CSD95411

SLPS751 – JANUARY 2023

Copyright © 2023 Texas Instruments Incorporated

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