LTC3113 datasheet(2/32 Pages) AD

2 / 32 page

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LT3154AV#PBF

Au (RoHS)

LHGJ

LQFN (Laminate Package

with QFN Footprint)

–40°C to 125°C

• Contact the factory for parts specified with wider operating

temperature ranges. *Pad or ball finish code is per IPC/JEDEC

J‑STD‑609.

• Recommended LGA and BGA PCB Assembly and Manufacturing Procedures

• LGA and BGA Package and Tray Drawings

LT3154

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

Supply Voltages

PVIN, VIN, PVOUT, VOUT ................................ –0.3V to 6V

SW1, SW2 Voltage (Notes 4, 6)

DC............................................................ –0.3V to 6V

PULSED (< 100ns) ....................................–1.0V to 7V

All Other Pins............................................... –0.3V to 6V

Operating Junction Temperature Range (Notes 2, 3, 5)

LT3154E/LT3154I............................... –40°C to 125°C

LT3154J............................................. –40°C to 150°C

Storage Temperature Range .................. –65°C to 150°C

Lead Temperature (Soldering, 10 sec)...................300°C

(Note 1)

PGND

16 15 14 13

PVIN

VIN

EN/UVLO

PVOUT

VOUT

TOP VIEW

LQFN PACKAGE

16-LEAD (3mm × 3mm × 0.74mm)

TJMAX = 150°C, DEMOBOARD θJA = 22°C/W

θJC = 9°C/W, JEDEC θJA = 42°C/W (NOTE 5)

EXPOSED PAD (PIN 17) IS PGND, MUST BE SOLDERED TO PCB

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