Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

Page 3 of 7

May 2005 - Rev 13-May-05

18.0-25.0 GHz GaAs MMIC

Receiver

R1006

Mechanical Drawing

Bias Arrangement

Bypass Capacitors

- See App Note [2]

(Note: Engineering designator is 22REC0281)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.787 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #3 (IF1)

Bond Pad #4 (Vd2)

Bond Pad #5 (LO)

Bond Pad #6 (Vg2b)

Bond Pad #7 (Vg2)

Bond Pad #8 (Vg2a)

Bond Pad #9 (IF2)

Bond Pad #10 (Vg1)

RF

Vd1

IF1

LO

Vd2

IF2

Vg2

Vg1

1

2

3

4

5

6

7

8

1.608

(0.063)

1.945

(0.077)

1.678

(0.066)

2.478

(0.098)

3.278

(0.129)

3.970

(0.156)

1.487

(0.059)

3.677

(0.145)

3.278

(0.129)

3.077

(0.121)

9

10

2.478

(0.098)

1.678

(0.066)

0.0

0.0

1

2

3

4

5

6

7

8

9

10

Vg1

Vg2

IF2

LO

Vd2

IF1

Vd1

RF