SFH640

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Vishay Semiconductors

Rev. 1.8, 02-Dec-2020

8

Document Number: 83682

For technical questions, contact: optocoupleranswers@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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Reel

Fig. 18 - Tape and Reel Shipping Medium

SOLDER PROFILES

IR Reflow Soldering (JEDEC® J-STD-020C compliant)

One time soldering reflow is recommended within the

condition of temperature and time profile shown below. Do

not solder more than three times.

Fig. 19

23012

1.8

+ 0.2

- 0

16.4

+ 1

- 0

PROFILE ITEM

CONDITIONS

Preheat

- Temperature minimum (TS min.)

150 °C

- Temperature maximum (TS max.)

200 °C

- Time (min. to max.) (tS)

90 s ± 30 s

Soldering zone

- Temperature (TL)

217 °C

- Time (tL)

60 s

Peak temperature (Tp)

260 °C

Ramp-up rate

3 °C/s max.

Ramp-down rate

3 °C/s to 6 °C/s

0

20406080

1000

10000

25

100

1000

10000

Time (s)

Axis Title

Time (s)

10

100

60 s

tL (soldering)

60 s to 120 s

tS (preheat)

35 s to 70 s

20 s

Tp (260 °C)

TL (217 °C)

TS max. (200 °C)

TS min.

(150 °C)

Ramp-up

Ramp-down

23016