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DS4550 Datasheet(PDF) 11 Page - Dallas Semiconductor |
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DS4550 Datasheet(HTML) 11 Page - Dallas Semiconductor |
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11 / 18 page ![]() Update-DR. A falling edge on TCK while in the Update-DR state latches the data from the shift regis- ter path of the test data registers into a set of output latches. This prevents changes at the parallel output because of changes in the shift register. On the rising edge of TCK, the controller goes to the Run-Test/Idle state if TMS is LOW or it goes to the Select-DR-Scan state if TMS is HIGH. Select-IR-Scan. All test data registers retain their previ- ous state. The Instruction Register remains unchanged during this state. With TMS LOW, a rising edge on TCK moves the controller into the Capture-IR state. TMS HIGH during a rising edge on TCK puts the controller back into the Test-Logic-Reset state. Capture-IR. The Capture-IR state is used to load the shift register in the Instruction Register with a fixed value. This value is loaded on the rising edge of TCK. If TMS is HIGH on the rising edge of TCK, the controller enters the Exit1-IR state. If TMS is LOW on the rising edge of TCK, the controller enters the Shift-IR state. Shift-IR. In this state, the shift register in the Instruction register is connected between TDI and TDO and shifts data one stage for every rising edge of TCK toward the TDO serial output while TMS is LOW. The parallel out- puts of the Instruction Register as well as all test data registers remain at their previous states. A rising edge on TCK with TMS HIGH moves the controller to the Exit1-IR state. A rising edge on TCK with TMS LOW keeps the controller in the Shift-IR state while moving data one stage through the Instruction Shift Register. Exit1-IR. A rising edge on TCK with TMS LOW puts the controller in the Pause-IR state. If TMS is HIGH on the rising edge of TCK, the controller enters the Update-IR state. Pause-IR. Shifting of the Instruction shift register is halt- ed temporarily. With TMS HIGH, a rising edge on TCK puts the controller in the Exit2-IR state. The controller remains in the Pause-IR state if TMS is LOW during a rising edge on TCK. Exit2-IR. A rising edge on TCK with TMS HIGH puts the controller in the Update-IR state. The controller loops back to Shift-IR if TMS is LOW during a rising edge of TCK in this state. Update-IR. The instruction code that has been shifted into the Instruction shift register is latched to the paral- lel outputs of the Instruction Register on the falling edge of TCK as the controller enters this state. Once latched, this instruction becomes the current instruc- tion. A rising edge on TCK with TMS LOW puts the con- troller in the Run-Test/Idle state. With TMS HIGH, the controller enters the Select-DR-Scan state. Instruction Register The Instruction Register contains a shift register as well as a latched parallel output and is 4 bits in length. When the TAP controller enters the Shift-IR state, the Instruction shift register is connected between TDI and TDO. While in the Shift-IR state, a rising edge on TCK with TMS LOW shifts the data one stage toward the serial output at TDO. A rising edge on TCK in the Exit1-IR state or the Exit2-IR state with TMS HIGH moves the controller to the Update- IR state. The falling edge of that same TCK latches the data in the Instruction shift register to the Instruction Register parallel output. Instructions supported by the DS4550 and its respective operational binary codes are shown in Table 2 below. SAMPLE/PRELOAD. This is a mandatory instruction for the IEEE 1149.1 specification that supports two functions. The digital I/Os of the device can be sam- pled at the Boundary Scan test data register without interfering with the normal operation of the device by using the Capture-DR state. SAMPLE/PRELOAD also allows the device to shift data into the Boundary Scan test data register through TDI using the Shift-DR state. BYPASS. When the BYPASS instruction is latched into the Instruction register, TDI connects to TDO through the 1-bit Bypass test data register. This allows data to pass from TDI to TDO without affecting the device’s normal operation. EXTEST. This instruction allows testing of all intercon- nections to the device. When the EXTEST instruction is latched in the Instruction register, the following actions occur. Once enabled through the Update-IR state, the parallel outputs of all digital output pins are driven. The Boundary Scan test data register is connected between TDI and TDO. The Capture-DR samples all digital inputs into the Boundary Scan test data register. I2C and JTAG Nonvolatile 9-Bit I/O Expander Plus Memory ____________________________________________________________________ 11 INSTRUCTION SELECTED REGISTER INSTRUCTION CODE SAMPLE/PRELOAD Boundary Scan 0010 BYPASS Bypass 1111 EXTEST Boundary Scan 0000 CLAMP Bypass 0011 HIGHZ Bypass 0100 IDCODE Identification 0001 ADDRESS Memory Address 1001 READ Memory Read 1010 WRITE Memory Write 1011 Table 2. Instruction Codes |
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