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STM32F103CBU7TR Datasheet(PDF) 99 Page - STMicroelectronics |
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STM32F103CBU7TR Datasheet(HTML) 99 Page - STMicroelectronics |
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99 / 116 page  DS5319 Rev 18 99/116 STM32F103x8, STM32F103xB Package information 115 Figure 60. TFBGA64 recommended footprint Marking of engineering samples Figure 61 gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to four decimal digits. Table 60. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 1.125 mm Pad trace width 0.100 mm Table 59. TFBGA64 mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max R8_FP_V1 Dpad Dsm |
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