FN2976 Rev.0.00

Page 21 of 21

March 1997

82C85

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Die Characteristics

DIE DIMENSIONS:

107.9 x 122.0 x 19

 1mil

METALLIZATION:

Type: Si - AL

Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8k

Å  1kÅ

WORST CASE CURRENT DENSITY:

2.26x 105 A/cm2

This device meets glassivation integrity test requirements

per MIL-STD-883 Method 2021

Metallization Mask Layout

82C85

AEN1

PCLK

CSYNC

VCC

X1

X2

ASYNC

EFI

F/C

OSC

RES

RESET

S2/STOP

S1

S0

SLO/FST

START

CLK50

GND

CLK

AEN2

RDY2

READY

RDY1