Nexperia

BSP52

NPN Darlington transistor

12. Package outline

UNIT

A1

bp

c

D

E

e1

HE

Lp

Q

y

w

v

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.10

0.01

1.8

1.5

0.80

0.60

b1

3.1

2.9

0.32

0.22

6.7

6.3

3.7

3.3

2.3

e

4.6

7.3

6.7

1.1

0.7

0.95

0.85

0.1

0.1

0.2

DIMENSIONS (mm are the original dimensions)

SOT223

SC-73

04-11-10

06-03-16

w M

bp

D

b1

e1

e

A

A1

Lp

Q

detail X

HE

E

v M A

A

B

B

c

y

0

2

4 mm

scale

A

X

1

3

2

4

Plastic surface-mounted package with increased heatsink; 4 leads

SOT223

Fig. 4. Package outline SC-73 (SOT223)

BSP52

All information provided in this document is subject to legal disclaimers.

© Nexperia B.V. 2018. All rights reserved

Product data sheet

23 February 2018

6 / 10