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DSPIC30F Datasheet(PDF) 235 Page - Microchip Technology

Part # DSPIC30F
Description  General Purpose and Sensor Families High-Performance Digital Signal Controllers
PDF  248 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F Datasheet(HTML) 235 Page - Microchip Technology

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 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 233
dsPIC30F
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
15
10
5
15
10
5
β
Mold Draft Angle Bottom
15
10
5
15
10
5
α
Mold Draft Angle Top
0.27
0.22
0.17
.011
.009
.007
B
Lead Width
0.23
0.18
0.13
.009
.007
.005
c
Lead Thickness
16
16
n1
Pins per Side
10.10
10.00
9.90
.398
.394
.390
D1
Molded Package Length
10.10
10.00
9.90
.398
.394
.390
E1
Molded Package Width
12.25
12.00
11.75
.482
.472
.463
D
Overall Length
12.25
12.00
11.75
.482
.472
.463
E
Overall Width
7
3.5
0
7
3.5
0
φ
Foot Angle
0.75
0.60
0.45
.030
.024
.018
L
Foot Length
0.25
0.15
0.05
.010
.006
.002
A1
Standoff
§
1.05
1.00
0.95
.041
.039
.037
A2
Molded Package Thickness
1.20
1.10
1.00
.047
.043
.039
A
Overall Height
0.50
.020
p
Pitch
64
64
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
c
2
1
n
D
D1
B
p
#leads=n1
E1
E
A2
A1
A
L
CH x 45
°
β
φ
α
(F)
Footprint (Reference)
(F)
.039
1.00
Pin 1 Corner Chamfer
CH
.025
.035
.045
0.64
0.89
1.14
§ Significant Characteristic



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