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DSPIC30F Datasheet(PDF) 237 Page - Microchip Technology

Part # DSPIC30F
Description  General Purpose and Sensor Families High-Performance Digital Signal Controllers
PDF  248 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F Datasheet(HTML) 237 Page - Microchip Technology

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 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 235
dsPIC30F
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
1.10
1.00
.043
.039
1.14
0.89
0.64
.045
.035
.025
CH
Pin 1 Corner Chamfer
1.00
.039
(F)
Footprint (Reference)
(F)
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
A
A1
A2
α
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
80
80
Pitch
p
.020
0.50
Overall Height
A
.047
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
§
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Foot Angle
φ
03.5
7
0
3.5
7
Overall Width
E
.541
.551
.561
13.75
14.00
14.25
Overall Length
D
.541
.551
.561
13.75
14.00
14.25
Molded Package Width
E1
.463
.472
.482
11.75
12.00
12.25
Molded Package Length
D1
.463
.472
.482
11.75
12.00
12.25
Pins per Side
n1
20
20
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.007
.009
.011
0.17
0.22
0.27
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
CH x 45
°
§ Significant Characteristic



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