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DSPIC30F Datasheet(PDF) 236 Page - Microchip Technology

Part # DSPIC30F
Description  General Purpose and Sensor Families High-Performance Digital Signal Controllers
PDF  248 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F Datasheet(HTML) 236 Page - Microchip Technology

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dsPIC30F
DS70083G-page 234
Preliminary
 2004 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
13
11
β
Mold Draft Angle Bottom
13
11
11
α
Mold Draft Angle Top
0.45
0.32
0.30
.018
.013
.019
B
Lead Width
0.20
0.09
.008
.004
c
Lead Thickness
16
16
n1
Pins per Side
14.00
.551
D1
Molded Package Length
14.00
.551
E1
Molded Package Width
16.00
.630
D
Overall Length
16.00
.630
E
Overall Width
7
0
7
0
φ
Foot Angle
0.75
0.60
0.45
.030
.024
.018
L
Foot Length
0.15
0.05
.006
.002
A1
Standoff
§
1.05
1.00
0.95
.041
.039
.037
A2
Molded Package Thickness
1.20
.047
A
Overall Height
0.80
.032
p
Pitch
64
64
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
c
2
1
n
D
D1
B
p
#leads=n1
E1
E
A2
A1
A
L
CH x 45
°
β
φ
α
(F)
Footprint (Reference)
(F)
.039
1.00
Pin 1 Corner Chamfer
CH
§ Significant Characteristic
11
13
13



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