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DSPIC30F Datasheet(PDF) 238 Page - Microchip Technology |
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DSPIC30F Datasheet(HTML) 238 Page - Microchip Technology |
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238 / 248 page ![]() dsPIC30F DS70083G-page 236 Preliminary 2004 Microchip Technology Inc. 80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) * Controlling Parameter Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-092 CH Pin 1 Corner Chamfer 1.00 .039 (F) Footprint (Reference) (F) E E1 #leads=n1 p B D1 D n 1 2 φ c β L A A1 A2 α Units INCHES MILLIMETERS* Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 80 80 Pitch p .026 0.65 Overall Height A .047 1.20 Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05 Standoff § A1 .002 .006 0.05 0.15 Foot Length L .018 .024 .030 0.45 0.60 0.75 Foot Angle φ 0 7 0 7 Overall Width E .630 16.00 Overall Length D .630 16.00 Molded Package Width E1 .551 14.00 Molded Package Length D1 . .551 14.00 Pins per Side n1 20 20 Lead Thickness c .004 .008 0.09 0.20 Lead Width B .009 .013 .015 0.22 0.32 0.38 Mold Draft Angle Top α 11 13 11 13 Mold Draft Angle Bottom β 11 13 11 13 CH x 45 ° § Significant Characteristic |
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