7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage

22

V

Analog inputs, VIN+, VIN– (2)

Differential (VIN+) − (VIN– )

−30

30

V

Common-mode

−20

120

V

REF1, REF2, NC inputs

GND − 0.3

VS + 0.3

V

Output

Output

GND – 0.3

Vs + 0.3

V

TA

Operating temperature

–55

150

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not

imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating

Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be

fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

HBM ESD classification level 2

±2000

V

Charged device model (CDM), per AEC Q100-011

CDM ESD classification level C6

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input range

−5

48

110

V

VS

Operating supply range

2.7

5

20

V

TA

Ambient temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA296x -Q1

UNIT

DDF (SOT23)

DGK (VSSOP)(2)

D (SOIC)(2)

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

129.7

TBD

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

58

TBD

TBD

°C/W

RθJB

Junction-to-board thermal resistance

52.6

TBD

TBD

°C/W

ΨJT

Junction-to-top characterization parameter

2.3

TBD

TBD

°C/W

ΨJB

Junction-to-board characterization parameter

52.3

TBD

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

This package is preview only.

INA296A-Q1, INA296B-Q1

SBOSA32 – FEBRUARY 2023

www.ti.com

4

Submit Document Feedback

Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: INA296A-Q1 INA296B-Q1