ZWIR4512 Datasheet

© 2018 Integrated Device Technology, Inc.

21

November 29, 2018

11. Package Outline Drawings

11.1 ZWIR4512AC1

The package outline drawings for the ZWIR4512AC1 parts are appended at the end of this document. The package information is the most

current data available.

11.2 ZWIR4512AC2

The package outline drawings for the ZWIR4512AC2 parts are appended at the end of this document and are accessible from the link below.

The package information is the most current data available.

https://www.idt.com/document/psc/zwir4512-package-outline-drawing-149-x-229-x-365-mm-body-20mm-pitch-mod0

12. Soldering Information

To ensure that soldered connections do not break during the reflow soldering process of the application PCB, the soldering profile described in

Table 12.1 and Figure 12.1 must be maintained. This profile is aligned with the profile defined in the IPC/JEDEC standard J-STD-020D.

Table 12.1 Soldering Profile Parameters (according to J-STD-020D)

Profile Feature

Symbol

Min

Max

Unit

Time 25°C to TP

tH

8

min

Peak package body temperature

TP

260

°C

Preheat / Soak

Soak temperature

TS

100

150

°C

Soak time

tS

60

120

s

Ramp-up

Ramp-up rate

TL to TP

3

°C/s

Time maintained above TL

tL

150

s

Time within 5°C of TP

tP

30

s

Ramp-down

Ramp-down rate

TP to TL

6

°C/s