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damage.

Solder Peg Retention

Force

5N/Pos. (Min.)

Place a connector on the push-pull machine, then

apply a force on a contact head and push the

latch to the opposite direction of the latch spring

insertion at the speed of 25±3mm/min.

Measure the force when the latch spring dislodges

from insulator.

Contact Retention Force

1N/Pos. (Min.)

Place a connector on the push-pull machine, the

apply a force on a contact head and push the

contact to the opposite direction of the contact

insertion at the speed of 25±3mm/min.

Measure the force when the contact dislodges

from insulator.

ENVIRONMENTAL

Item

Requirement

Test Condition

Humidity Temperature

Cycle

No evidence of physical

damage.

EIA-364-31,method III

Mated Connector. Initial measurement, cold shock

and vibration. Cycle the connector between 25±3

℃

at 80±3%RH and 65±3℃ at 50±3%RH.

Ramp times should be 0.5 hour and dwell times

should be 1.0 hour. Dwell times start when the

temperature and humidity have stabilized within

the specified levels. Perform 24 such cycles.

Thermal Shock

No evidence of physical

damage.

EIA-364-32, test condition I

Mated Connector, 10 cycles

Temperature Life

No evidence of physical

damage.

EIA-364-17, method A

Mated Connector, 105℃, 120 hours

Temperature Life

(Preconditioning)

No evidence of physical

damage.

EIA-364-17, method A

Mated Connector, 105℃, 92 hours

Reseating

No evidence of physical

damage.

Manually mating/unmating the connector. Perform

3 such cycles.

SOLDER ABILITY

Item

Requirement

Test Condition

Reflow Soldering Heat

Resistance

No evidence of physical

damage.

Pre-heat: 150~215℃, 30~120 sec.

Reflow: 230℃ MIN, 40 sec Min.

Peak temp:260℃ Max, 10 sec Max.

[ Reference to Figure 3 ]

Solder Ability

Solder coverage 95%Min.

EIA-364-52

Solder 5±0.5 seconds.

Solder temperature:245±5℃