LT8650SP

2

Rev. B

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN1, VIN2, EN/UV1, EN/UV2, PG1, PG2.....................42V

BIAS..........................................................................30V

FB1, FB2, SS1, SS2 . ...................................................4V

VC1, VC2..................................................................3.5V

SYNC. .........................................................................6V

Operating Junction Temperature Range (Note 2)

LT8650SPJ ............................................–40 to 150°C

Storage Temperature Range ..................–65 to 150°C

Maximum Reflow (Package Body)

Temperature......................................................260°C

(Note 1)

LQFN PACKAGE

32-LEAD (4mm × 6mm × 0.94mm)

θJA = 15.6°C/W, (Based on Demoboard)

θJC-TOP = 0.93°C/W,

θJC-BOTTOM = 4.4°C/W

EXPOSED PAD (PINS 33, 34, 35, 36, 37, 38) ARE GND, MUST BE SOLDERED TO PCB

EXPOSED DIE AT TOP OF PACKAGE MUST HAVE HEAT SINK ATTACHED

FOR FULL PERFORMANCE

TOP VIEW

27

28

29

30

31

32

16

15

14

13

12

11

26

25

24

23

22

20

19

18

17

BIAS

VCC

BST1

SW1

SW1

SW2

SW2

BST2

CLKOUT

1

2

4

5

7

8

10

RT

GND

VIN1

VIN1

VIN2

VIN2

GND

33

GND

34

GND

35

GND

36

GND

37

GND

38

GND

ORDER INFORMATION

LEAD FREE FINISH

TAPE AND REEL

PAD OR BALL

FINISH

PART MARKING*

PACKAGE DESCRIPTION**

MSL

RATING

TEMPERATURE

RANGE (SEE NOTE 2)

DEVICE

FINISH CODE

LT8650SPJV#PBF

LT8650SPJV#TRPBF

Au (RoHS)

8650SPV

e4

LQFN (Laminate

Package with QFN

Footprint)

3

–40°C to 150°C

AUTOMOTIVE PRODUCTS***

LT8650SPJV#WPBF LT8650SPJV#WTRPBF

Au (RoHS)

8650SPV

e4

LQFN (Laminate

Package with QFN

Footprint)

3

–40°C to 150°C

• Contact the factory for parts specified with wider operating temperature ranges.

*The temperature grade is identified by a label on the shipping container

Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and

Manufacturing Procedures

• LGA and BGA Package and Tray Drawings

**The LT8650SP package has the same dimensions as a standard 6mm × 4mm QFN package

***Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These

models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your

local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for

these models.