09/19/02 2:30 PM_GS

REV. A

–16–

AD5532B

The power supply lines of the AD5532B should use as large a trace

as possible to provide low impedance paths and reduce the effects of

glitches on the power supply line. Fast switching signals such as

clocks should be shielded with digital ground to avoid radiating

noise to other parts of the board, and should never be run near

SCLK lines will help reduce crosstalk between them (not required

on a multilayer board as there will be a separate ground plane,

but separating the lines will help).

must be kept noise-free. Depending on the noise performance of

line. If this capacitor is necessary, then for optimum throughput

Avoid crossover of digital and analog signals. Traces on opposite

sides of the board should run at right angles to each other. This

reduces the effects of feedthrough through the board. A microstrip

technique is by far the best, but not always possible with a double-

sided board. In this technique, the component side of the board

is dedicated to ground plane while signal traces are placed on the

solder side.

As is the case for all thin packages, care must be taken to avoid

flexing the package and to avoid a point load on the surface of

the package during the assembly process.

OUTLINE DIMENSIONS

74-Lead Chip Scale Ball Grid Array [CSPBGA]

(BC-74)

Dimensions shown in millimeters

A

B

C

D

E

F

G

H

J

K

L

11 10 9 8

7 6

5 4 3 2

1

1.00

BSC

1.00 BSC

BOT TOM

VIEW

A1

TOP VIEW

DETAIL A

1.70

MAX

12.00 BSC

SQ

10.00 BSC

SQ

A1 CORNER

INDEX AREA

SEATING

PLANE

DETAIL A

BALL DIAMETER

0.30 MIN

0.70

0.60

0.50

0.20 MAX

COPLANARITY

COMPLIANT TO JEDEC STANDARDS MO-192ABD-1

Revision History

Location

Page

9/02—Data Sheet changed from REV. 0 to REV. A.

Term LFBGA updated to CSPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Global

Changes to SERIAL INTERFACE table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Replaced Figure 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Changes to Figure 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Updated BC-74 package drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16