NXP Semiconductors

NVT2001; NVT2002

Bidirectional voltage level translator for open-drain and push-pull applications

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak

temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to

make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low

enough that the packages and/or boards are not damaged. The peak temperature of the package depends on

package thickness and volume and is classified in accordance with Table 13 and Table 14

Package reflow temperature (°C)

Volume (mm³)

Package thickness (mm)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

220

Table 13. SnPb eutectic process (from J-STD-020D)

Package reflow temperature (°C)

Volume (mm³)

Package thickness (mm)

< 350

350 to 2000

> 2000

< 1.6

260

260

260

1.6 to 2.5

260

250

245

> 2.5

250

245

245

Table 14. Lead-free process (from J-STD-020D)

Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.

Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 20.

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

MSL: Moisture Sensitivity Level

Figure 20. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow

soldering description”.

NVT2001_NVT2002

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Product data sheet

Rev. 4.4 — 22 May 2023

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