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TEA2017ABT/2 Datasheet(PDF) 52 Page - NXP Semiconductors

Part # TEA2017ABT/2
Description  Digital configurable LLC and DCM/QR PFC controller
PDF  67 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

TEA2017ABT/2 Datasheet(HTML) 52 Page - NXP Semiconductors

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NXP Semiconductors
TEA2017ABT/2
Digital configurable LLC and DCM/QR PFC controller
Tamb = 25 °C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the
IC; unless otherwise specified.
Expected values for different MTP settings (min/typ/max) are provided in the documentation in the Ringo software.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Ibo
brownout current
4.6
4.8
5.0
μA
Ibo(hys)
hysteresis of brownout current Ibi − Ibo
0.66
0.73
0.80
μA
PFC
45
50
55
ms
td(det)bo
brownout detection delay time
LLC
225
250
275
ms
External overtemperature measurement
Io(SNSMAINS)
output current on pin
SNSMAINS
−645
−600
−565
μA
tdet(max)NTC
NTC maximum detection time
45
50
55
μs
Vdet(SNSMAINS)
detection voltage on pin
SNSMAINS
NTC measurement;
ISNSMAINS = −600 μA
2.89
3.08
3.27
V
td(otp)
overtemperature protection
delay time
3.6
4.0
4.4
s
X-capacitor discharge
td(dch)
discharge delay time
180
200
220
ms
SNSCURPFC pin
Io(min)SNSCURPFC
minimum output current on pin
SNSCURPFC
for open pin protection;
VSNSCURPFC = 500 mV
−0.8
−0.6
−0.4
μA
Vdet(SNSCURPFC)
detection voltage on pin
SNSCURPFC
open pin detection level
190
235
280
mV
Vdet(demag)
demagnetization detection
voltage
−15
−10
−5
mV
Vocp(PFC)
PFC overcurrent protection
voltage
−320
−300
−275
mV
td(swoff)driver
driver switch-off delay time
dV/dt ≤ −0.5 V/μs
300
375
450
ns
Valley sensing (DRAINPFC pin)
ΔVdet(min)/Δt
minimum slope detection
voltage
−50
-
-
V/μs
ΔVdet(min)
minimum detection voltage
change
ringing frequency = 1 MHz
9
15
21
V
tto(vrec)
valley recognition time-out time
6.3
7.0
7.7
μs
PFC
PFC timing
toff(PFC)min
PFC minimum off-time
0.45
0.50
0.55
μs
Table 7. Characteristics...continued
TEA2017ABT_2
All information provided in this document is subject to legal disclaimers.
© 2023 NXP B.V. All rights reserved.
Product data sheet
Rev. 1.1 — 17 May 2023
52 / 67



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