LP62S1024B-I Series

(August, 2004, Version 1.2)

16

AMIC Technology, Corp.

Package Information

36LD CSP (6 x 8 mm) Outline Dimensions

unit: mm

A

B

C

D

E

F

G

H

TOP VIEW

Ball#A1 CORNER

SIDE VIEW

C

SEATING PLANE

A

B

C

D

E

F

G

H

12

34

56

1

2

3

4

5

6

C

0.10

C

S

A B

b (36X)

BOTTOM VIEW

Ball*A1 CORNER

B

e

D

A

0.20(4X)

Dimensions in mm

Symbol

MIN.

NOM.

MAX.

A

1.00

1.10

1.20

0.16

0.21

0.26

0.48

0.53

0.58

D

5.80

6.00

6.20

E

7.80

8.00

8.20

---

3.75

---

---

5.25

---

e

---

0.75

---

b

0.25

0.30

0.35

Note:

1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS

ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).

2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS

OF THE SOLDER BALLS.

3. DIMENSION b IS MEASURED AT THE MAXIMUM.

4. THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF THE

SOLDER BALL AND THE BODY EDGE.