Specifications and information are subject to change without notice.

WJ Communications, Inc

Phone 1-800-WJ1-4401 FAX: 408-577-6621

e-mail: sales@wj.com

Web site: www.wj.com

Page 7 of 7 July 2006

FH1

High Dynamic Range FET

Product Information

FH1-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260

qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

qC

59

qC / W

126

qC

1. The thermal resistance is referenced from the hottest

part of the junction to the ground tab (pin 4).

2. This corresponds to the typical biasing condition of

+5V, 140 mA at an 85 C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 160 C.

Product Marking

The FH1-G will be marked with an “FH1G”

designator.

An alphanumeric lot code

(“XXXX-X”) is also marked below the part

designator on the top surface of the package.

The obsolete tin-lead package is marked with

an “FH1” designator followed by an

alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1B

Value:

Passes

500V to <1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes

1000V to <2000V

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260 C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance of this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010” ).

2. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.

MTTF vs. GND Tab Temperature

1

10

100

1000

60

70

80

90

100

110

Tab Temperature (°C)