2000 Jan 04

6

Philips Semiconductors

Product specification

UHF amplifier module

BGY2016

MOUNTING RECOMMENDATIONS

To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base

is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and

loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of

a solid heatsink should be not less than 5 mm to ensure a rigid assembly.

A thin, even layer of thermal compound should be applied between the mounting base and the heatsink to achieve the

best possible thermal contact resistance. Excessive use of thermal compound will result in an increase in thermal

resistance and possible bowing of the mounting base; too little will also result in poor thermal conduction.

The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be tightened to

“finger tight” and then further tightened in alternating steps to a maximum torque of 0.4 to 0.6 Nm.

Once mounted on the heatsink, the module leads can be soldered to the printed-circuit board. A soldering iron may be

used up to a temperature of 250

°C for a maximum of 10 seconds at a distance of 2 mm from the plastic cap.

ESD precautions must be taken to protect the device from electrostatic damage.