1996 Oct 10

16

Philips Semiconductors

Product specification

VHF linear power transistor

BLV33

PACKAGE OUTLINE

Fig.22 SOT147.

handbook, full pagewidth

MBC850

e

c

b

e

13 max

29

27

29

27

6.5

min

(4x)

(4x)

5.9

5.5

1.9

max

5.30

4.85

13.4

12.6

8.3

max

1/4"x 28 UNF

0.14

11

5.5

metal

BeO

ceramic

Dimensions in mm.

Torque on nut: min. 2.3 Nm; max. 2.7 Nm.

Diameter of clearance hole in heatsink: max. 6.4 mm.

Mounting hole to have no burrs at either end.

De-burring must leave surface flat; do not chamfer or countersink either end of hole.

When locking is required an adhesive is preferred instead of a lock washer.