ADG787 datasheet(15/16 Pages) AD

15 / 16 page

ADG787

Rev. A | Page 15 of 16

SEATING

PLANE

0.50 BSC

BALL PITCH

1.56

1.50

1.44

0.26

0.22

0.18

0.11

0.09

0.07

0.36

0.32

0.28

0.63

0.57

0.51

BOTTOM

VIEW

(BALL SIDE UP)

2.06

2.00

1.94

TOP VIEW

(BALL SIDE DOWN)

BALL 1

IDENTIFIER

Figure 40. 10-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding1

ADG787BRMZ2

–40°C to +85°C

10-Lead Mini Small Outline Package (MSOP)

RM-10

SM1

ADG787BRMZ-500RL72

–40°C to +85°C

10-Lead Mini Small Outline Package (MSOP)

RM-10

SM1

ADG787BRMZ-REEL2

–40°C to +85°C

10-Lead Mini Small Outline Package (MSOP)

RM-10

SM1

ADG787BCBZ-500RL72

–25°C to +85°C

10-Ball Wafer Level Chip Scale Package (WLCSP)

CB-10

S04

ADG787BCBZ-REEL2

–25°C to +85°C

10-Ball Wafer Level Chip Scale Package (WLCSP)

CB-10

S04

ADG787BCPZ-500RL72

–40°C to +85°C

10-Lead Lead Frame Chip Scale Package (LFCSP_WD)

CP-10-9

SM1

ADG787BCPZ-REEL2

–40°C to +85°C

10-Lead Lead Frame Chip Scale Package (LFCSP_WD)

CP-10-9

SM1

1 Due to space constraints, branding on this package is limited to three characters.

2 Z = Pb-free part.

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