ADG888 datasheet(12/16 Pages) AD

12 / 16 page

ADG888

Rev. A | Page 12 of 16

OUTLINE DIMENSIONS

BALL 1

IDENTIFIER

SEATING

PLANE

0.50

BALL

PITCH

2.06

2.00 SQ

1.94

0.28

0.24

0.20

0.65

0.59

0.53

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

0.36

0.32

0.28

0.11

0.09

0.07

Figure 26. 16-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-16)

Dimensions shown in millimeters

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 27. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.30

0.23

0.18

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

PIN 1

INDICATOR

0.75

0.60

0.50

0.25 MIN

2.25

2.10 SQ

1.95

Figure 28. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-4)

Dimensions shown in millimeters

ADG888 Datasheet(PDF) 12 Page - Analog Devices

ADG888 Datasheet(HTML) 12 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Datasheet Download

Link URL