ADG888 datasheet(13/16 Pages) AD

Part #	ADG888

Description	0.4 OHM CMOS, Dual DPDT Switch in WLCSP/LFCSP/TSSOP Packages

PDF	16 Pages

Scroll/Zoom	100%

Manufacturer	AD [Analog Devices]

Direct Link	http://www.analog.com

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13 / 16 page

ADG888

Rev. A | Page 13 of 16

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding1

ADG888YRUZ2

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG888YRUZ-REEL2

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG888YRUZ-REEL72

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG888YCPZ-REEL2

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

S0D

ADG888YCPZ-REEL72

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

S0D

ADG888BCBZ-REEL2

−40°C to +85°C

16-Ball Wafer Level Chip Scale Package [WLCSP]

CB-16

S02

ADG888BCBZ-REEL72

−40°C to +85°C

16-Ball Wafer Level Chip Scale Package [WLCSP]

CB-16

S02

EVAL-ADG888EB

Evaluation Board

1 Branding on these packages is limited to three characters due to space constraints.

2 Z = Pb-free part.

ADG888 Datasheet(PDF) 13 Page - Analog Devices

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