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ADG1208 Datasheet(PDF) 17 Page - Analog Devices

Part # ADG1208
Description  Low Capacitance, 4-/8-Channel -15 V/12 V iCMOS Multiplexers
PDF  20 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADG1208 Datasheet(HTML) 17 Page - Analog Devices

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ADG1208/ADG1209
Rev. 0 | Page 17 of 20
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 40. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.30
0.23
0.18
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.75
0.60
0.50
0.25 MIN
2.25
2.10 SQ
1.95
Figure 41. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG1208YRUZ1
−40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG1208YRUZ-REEL71
−40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG1208YCPZ-REEL1
−40°C to +125°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
ADG1208YCPZ-REEL71
−40°C to +125°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
ADG1209YRUZ1
−40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG1209YRUZ-REEL71
−40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG1209YCPZ-REEL1
−40°C to +125°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
ADG1209YCPZ-REEL71
−40°C to +125°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
1 Z = Pb-free part.



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