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NTS0102GD Datasheet(PDF) 2 Page - NXP Semiconductors |
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NTS0102GD Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 43 page ![]() NXP Semiconductors NTS0102 Dual supply translating transceiver; open-drain; auto direction sensing Package Type number Topside marking Name Description Version NTS0102GT s02 XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 × 1.95 × 0.5 mm SOT833-1 NTS0102GD s02 XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 3 × 2 × 0.5 mm SOT996-2 NTS0102GF s2 XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 × 1 × 0.5 mm SOT1089 NTS0102TL tS2 XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm SOT1052-2 NTS0102JK s2 X2SON8 super thin small outline; no leads, 8 terminals, 0.35 mm pitch, 1.35 mm x 1 mm x 0.32 mm body SOT2015-1 Table 1. Ordering information...continued 4.1 Ordering options Type number Orderable part number Package Packing method[1] Minimum order quantity Temperature NTS0102DP NTS0102DP,125 TSSOP8 Reel 7" Q3 NDP 3000 –40 °C to +125 °C NTS0102GT NTS0102GT,115 XSON8 Reel 7" Q1 NDP 5000 –40 °C to +125 °C NTS0102GD[2] NTS0102GD,125 XSON8 Reel 7" Q3 NDP 3000 –40 °C to +125 °C NTS0102GF NTS0102GF,115 XSON8 Reel 7" Q1 NDP 5000 –40 °C to +125 °C NTS0102TL NTS0102TLH XSON8 Reel 7" Q3 NDP 4000 –40 °C to +125 °C NTS0102JK NTS0102JKZ X2SON8 Reel 7" Q1 NDP SSB 6000 –40 °C to +125 °C Table 2. Ordering options [1] Standard packing quantities and other packaging data are available at www.nxp.com/packages/. [2] Discontinuation Notice 202111012DN - drop in replacement is NTS0102TLH. The TL package has a center pad vs no center pad for the GD package. The TL package pad is not electrically connected to the silicon and is not required to connect to the PCB so it can drop onto the GD package PCB layout. If the existing GD package has a trace underneath the risk is low since the TL package center pad is not connected to the silicon. If there are multiple traces there could be EMI and cross talk. In both cases the customer needs to evaluate risk. Note: The length and width are reversed between the "GD" and "TL" package drawings but the shorter edge contains the pins and is 2.0 mm in both cases. NTS0102 All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 4.5 — 6 July 2023 2 / 43 |
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