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TAS5261 Datasheet(PDF) 17 Page - Texas Instruments |
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TAS5261 Datasheet(HTML) 17 Page - Texas Instruments |
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17 / 21 page ![]() www.ti.com Error Reporting Over Current (OC) Protection With Current Device Protection System TAS5261 SLES188 – AUGUST 2006 Limiting and Overload Detection The SD and OTW pins are both active-low, open-drain outputs. Their function is for The device has independent, fast-reacting current protection-mode signaling to a PWM controller or detectors with programmable trip threshold (OC other system-control device. Any fault resulting in threshold) on all high-side and low-side power-stage device shutdown is signaled by the SD pin going low. FETs. See Table 3 for OC-adjust resistor values. The Likewise, OTW goes low when the device junction detector outputs are closely monitored by two temperature exceeds 115 °C. (see Table 2). protection systems. The first protection system controls the power stage in order to prevent the Table 2. Error Reporting output current from further increasing. For instance, it performs a current-limiting function rather than SD OTW DESCRIPTION prematurely shutting down during combinations of Over Temperature (OTE) or Over high-level music transients and extreme speaker 0 0 Load (OLP) or Under Voltage (UVP) load impedance drops. If the high-current situation Over Load (OLP), PWM Activity persists, i.e., the power stage is being overloaded, a 0 1 Dectector, or Under Voltage (UVP) second protection system triggers a latching Over Temperature Warning. Junction shutdown, resulting in the power stage being set in 1 0 temperature higher than 125 °C. the high-impedance (Hi-Z) state. Normal operation. Junction 1 1 temperature lower than 125 °C. Table 3. OC-Adjust Resistor Values It should be noted that asserting RESET low forces CURRENT BEFORE OC OCCURS OC-ADJUST (A) the SD and OTW signals high, independent of faults RESISTOR VALUES (k Ω) (1) being present. It is recommended to monitor the MIN TYP MAX OTW signal using the system microcontroller and 22 15 16 17 respond to an overtemperature warning signal by, for 27 12 13 14 example, turning down the volume to prevent further 47 7 8 8 heating of the device resulting in device shutdown 68 5 5 6 (OTW). To reduce external component count, an internal pullup resistor to 3.3 V is provided on both 100 3 4 4 the SD and OTW outputs. Level compliance for 5-V (1) Resistor tolerance is ±5%. logic can be obtained by adding external pullup resistors to 5 V (see the Electrical Characteristics For lowest-cost bill of materials in terms of section of this data sheet for further specifications). component selection, the OC threshold current should be limited, considering the power output requirement and minimum load impedance. Higher-impedance loads require a lower OC The TAS5261 contains advanced protection circuitry threshold. carefully designed to facilitate system integration and ease of use, as well as safeguarding the device from The demodulation filter inductor must retain a permanent failure due to a wide range of fault minimum of 5-H inductance at twice the selected OC conditions, such as short circuit, overload, and threshold current. undervoltage. The TAS5261 responds to a fault by Most inductors have decreasing inductance with immediately setting the power stage in a increasing temperature and increasing current high-impedance state (Hi-Z) and asserting the SD (saturation). To some degree, an increase in pin low. In situations other than overload, the device temperature naturally occurs when operating at high automatically recovers when the fault condition has output currents, due to inductor core losses and the been removed (e.g., the voltage supply has dc resistance of the inductor copper winding. A increased). For highest possible reliability, recovering thorough analysis of inductor saturation and thermal from an overload fault requires external reset of the properties is strongly recommended. device no sooner than 1 s after the shutdown (see the Device Reset section of this data sheet). Setting the OC threshold too low might cause issues, such as lack of enough output power and/or unexpected shutdowns due to sensitive overload detection. In general, it is recommended to follow closely the external component selection and PCB layout as given in the Application Information section of this data sheet. 17 Submit Documentation Feedback |
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